OIF, where the optical networking industry’s interoperability work gets done, has published a new Implementation Agreement (IA) for Common Electrical I/O (CEI) 5.0 specifying the next generation of 112Gb/s electrical interconnects. The IA specifies transmitter, receiver and channel requirements associated with Extra Short Reach (XSR), Medium Reach (MR) and Long Reach (LR) interfaces for multi-chip-module, chip-to-chip, and high-speed backplane applications.
“This IA marks a new generation of specifications for 112G interfaces,” said Klaus-Holger Otto, Nokia and OIF Technical Committee Chair. “It is a continuation of OIF’s proud history of adding next-generation data rates that enable broad interconnect solutions and are critical building blocks for several industry standards and platforms.”
“These new data rate specifications will enable applications including backplane, chip-to-chip, and die-to-die interfaces within a package,” said David Stauffer, Kandou Bus and Chair of OIF’s Physical and link Layer (PLL) Working Group. “And, it enables multiple applications, such as co-packaged optics. Definitions of interfaces within co-packaged die are unique to this IA and OIF’s work.”
